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 MOTOROLA TECHNICAL DATA
Freescale Semiconductor, Inc.Rev: 2.71 Date: 15 Dec 2004
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MC33689
LIN System basis chip
SILICON MONOLITHIC INTEGRATED CIRCUIT
System Basis Chip with LIN transceiver
The LIN SBC is a monolithic integrated circuit combining many functions frequently used by automotive LIN distributed slave nodes. It incorporates: - Single voltage regulator with low power modes - LIN physical interface. - Wake up inputs. - Triple high side driver - Current sense op amp
Pin out SO32WB fine pitch
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* Vdd: Low drop voltage regulator, current limitation, over temperature detection, monitoring and reset function, current capability 50mA. * Programmable window watchdog * Three operational modes (normal, stop and sleep modes) * Low current consumption in sleep and stop modes * LIN physical interface compatible with LIN standard. * Two external high voltage wake-up inputs * Dual high side switches, relay driver capability, internal clamp, PWM capability. * Single low current high side switch, 50mA capability for switch bias and hall sensor supply * Current sense amplifier * Nominal DC operating voltage from 5.5 to 27V * 40V maximum transient voltage * Wake up capabilities (wake up inputs, LIN interface)
NC L1 NC L2 HS3 HS2 HS1 T-GND T-GND VS2 LIN GND VS1 NC Vdd aGND
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16
32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17
TX RX INT CSB MISO MOSI SCLK T-GND T-GND IN Reset Wdc e+ eOut Vcc
Simplified Block Diagram
Vs1
5V/50mA
Vdd
Vbat
Voltage Regulator Reset control
Reset
Vs2
Window Watchdog
Wdc
HS1
IN
HS2
SPI and Mode
HS3
pre driver
Control
MOSI MISO SCK CSB INT
L2
Vcc
E-
amplifier
L1
E+
Vs1
Out
ORDERING INFORMATION
Device Operating Temperature Range Package
LIN
LIN Physical Interface Gnd aGnd
TX RX MC33689DWB/R2
TA = -40 to 125C
SO-32
This document contains information on a product under development. Motorola reserves theOn This For More Information right to change or discontinue this product without notice.
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(c) Motorola,Inc 2004
Freescale Semiconductor, Inc. MC33689
1 MAXIMUM RATINGS
Ratings ELECTRICAL RATINGS Symbol Min Typ Max Unit
Supply Voltage at Vs1 and Vs2 - Continuous voltage - Transient voltage (Load dump) Supply Voltage Vdd and Vcc Logic Inputs: MOSI, SCK, CSB, IN, Tx Logic output: MISO, INT, Rx, Reset Output current Vdd E+, E- input voltage
V Vsupdc Vsuptr Vdd Vinlog Voutlog Idd Ve+Ie+Vout Iout -0.3 -20 -0.3 -20 -0.3 27 40 5.5 Vdd+0.3 Vdd+0.3 Internally limited 7 20 Vcc+0.3 20 V V V A V mA V mA
-0.3 - 0.3 - 0.3
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E+, E- input current Out output voltage Out output current L1 and L2 - DC Input voltage with a 33k resistor - Transient input voltage (according to ISO7637 specification) and with external component (see figure 1 below). HS1 and HS2 output
Vlxdc Vlxtr
-18V -100
40 +100
V V
Vhs12
internally clamped -0.3
Vs2+0.3
V
HS3 LIN - DC voltage Transient input voltage (according to ISO7637 specification) and with external component (see figure 1 below). ESD voltage (HBM 100pF, 1.5k) (GND, T-GND and aGND pins connected together and configured as ground) - LIN, L1, L2 - All other pins ESD voltage (HBM 100pF, 1.5k) (GND pin configured as ground, T-GND and aGND pins as I/O) - LIN, L1, L2 - All other pins ESD voltage (Machine Model) All pins (GND, T-GND and aGND pins connected together and configured as ground) ESD voltage (Machine Model) All pins (GND pin configured as ground, T-GND and aGND pins as I/O)
THERMAL RATINGS
Vhs3
Vs2+0.3
V V
Vbusdc Vbustr
-18 -150
+40 +100
Vesdh
kV
-4 -2 Vesdh
4 2 kV
-4 -2 Vesdm -200
4 2 200 V
Vesdm
-150
150
V
Junction Temperature Storage Temperature Ambient Temperature (for info only) Thermal resistance junction to ambient
Tj Ts Ta Rthj/a
- 40 - 55 - 40
+150 +165 +85 80
C C C C/W
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Figure 1. : Transient test pulses for LIN and Wake pins
1nF L1 and L2 10 k
Transient Pulse Generator (note) Gnd
Gnd
note: Waveform in accordance to ISO7637 part1, test pulses 1, 2, 3a and 3b.
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2 ELECTRICAL CHARACTERISTICS
(Vs1 and Vs2 from 5.5V to 18V and Tamb from -40C to 125C unless otherwise noted)
Characteristics Description Vs1 and Vs2 pins (Device power supply) Nominal DC Voltage range Input Voltage during Load Dump Input Voltage during jump start Supply Current in Normal Mode (note 2) Supply Current in Sleep Mode (note 2) Supply Current in Stop Mode (note 2) Supply voltage fall early warning threshold VSUV flag hysteresis Supply voltage over voltage warning threshold VSOV flag hysteresis
Vsup VsupLD VsupJS Isup(norm)
Symbol Min Typ Max
Unit
Conditions
5.5
18 40 27 5 30 60 7.5 40 75 6.6
V V V mA uA uA V V Load dump situation Jump start situation (note 1) Iout at Vdd =10mA, LIN recessive state Vdd off, Vsup<=13.5V Vdd ON with Iout<100uA, Vsup<=13.5V Normal mode, INT generated, bit VSUV set guaranteed by design Normal mode, INT generated, bit VSOV set guaranteed by design
Isleep Istop
VSUVew VSUVhyst VSOVw VSOVhyst
5.7
6 1
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18
19.25 220
20.50
V mV
note 1: Device is fully functional. All functions are operating. Over temperature may occur. note 2: Total current (IVs1+IVs2) measured at gnd pins. Vdd (external 5V output for MCU supply). Specification with external capacitor 2uF 4.5V Internally limited Normal mode, INT generated, Bit VddT set guaranteed by design Normal mode guaranteed by design Normal mode (Tsd-Tpre) guaranteed by design 0.5Thermal Shutdown (junction) Temperature threshold difference Vsup range for Reset Active Line Regulation Load Regulation
Tsd
155 20
170 30 45
C C V
Vsupr LR LD
3.5 20 40 150 150
mV mV
note 1: measured when voltage has dropped 100mV below its nominal value. note 2: total Vdd regulator current. A 5mA current for operational amplifier operation is included. Digital output supplied from Vdd. Vdd: in Stop mode Vdd Output Voltage (note 1) Idd current capability (note 2) Line regulation Load regulation Vddstop Idds LR-s LD-s 4.75 4 5,00 8 10 40 5.25 14 100 150 V mA mV mV Idd<=2mA Stop mode 5.5Vnote 1: when switching from Normal mode to Stop mode, or from Stop mode to Normal mode the output voltage can varies within the output voltage specification. note 2: when Idd is above Idds device enters reset mode Reset: normal and stop modes (output pin only) Reset threshold High Level Output current Low Level Output Voltage (I0=1.5mA) Rst-th1 Ioh Vol 0 4.50 4.68 -250 0.9 Vdd-0.2 V A V Vout>0.7Vdd 4.5VMC33689
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(Vs1 and Vs2 from 5.5V to 18V and Tamb from -40C to 125C unless otherwise noted)
Characteristics Description Symbol Min Reset pull down current Reset Duration after Vdd High IN: input High Level Input Voltage Low Level Input Voltage Input Current MISO: SPI output Low Level Output Voltage High Level Output Voltage Vol Voh 0 Vdd-0.9 -2 1.0 Vdd +2 V V uA I out = 1.5mA I out = -250uA 0VFreescale Semiconductor, Inc...
Tristated MISO Leakage Current MOSI, SCLK, CSB: SPI input High Level Input Voltage Low Level Input Voltage CSB Pull up current source MOSI, SCK Input Current SPI: DIGITAL INTERFACE TIMING SPI operation frequency SCLK Clock Period SCLK Clock High Time SCLK Clock Low Time Falling Edge of CS to Rising Edge of SCLK Falling Edge of SCLK to CS Rising Edge MOSI to Falling Edge of SCLK Falling Edge of SCLK to MOSI MISO Rise Time (CL = 220pF) MISO Fall Time (CL = 220pF) Time from Falling or Rising Edges of CS to: - MISO Low Impedance - MISO High Impedance Time from Rising Edge of SCLK to MISO Data Valid Freq tpCLK twSCLKH twSCLKL tlead tlag tSISU tSIH trSO tfSO tSOEN tSODIS tvalid Vih Vil Iih Iin
0.7Vdd -0.3 -100 -10
Vdd+0.3 0.3Vdd -20 10 V uA uA Vi 1V to 3.5V 00.25 250 125 125 100 100 40 40 25 25 0
4 N/A N/A N/A N/A N/A N/A N/A 50 50 50 50 50
MHz ns ns ns ns ns ns ns ns ns ns guaranteed by design guaranteed by design guaranteed by design 0.2 V1==0.8V1, CL=100pF guaranteed by design
0
ns
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(Vs1 and Vs2 from 5.5V to 18V and Tamb from -40C to 125C unless otherwise noted)
Characteristics Description Symbol Min Typ Max Unit Conditions
Figure 2. SPI Timing characteristic
Tpclk
CSB
Tlead Twclkh Tlag
SCLK
Twclkl
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Tsisu
Tsih
MOSI
Undefined
Tvalid
Di 0
Don't Care
Di 8
Don't Care
Tsodis
Tsoen
MISO
Do 0
Do 8
Note: Incoming data at MOSI pin is sampled by the SBC at SCLK falling edge. Outcoming data at MISO pin is set by the SBC at SCLK rising edge (after Tvalid delay time)
INT: output pin Low Level Output Voltage (I0=1.5mA) High Level Output Voltage (I0=-250uA) Vol Voh 0 Vdd-0.9 0.9 Vdd V
WDC: window watchdog configuration pin External resistor range Watchdog period accuracy with external resistor Watchdog period with external resistor Watchdog period with external resistor Watchdog period without external resistor, Conf pin open Rext Wdcacc Wdp 10 Wdp 100 PWdoff 97 10 -15 10.558 99.748 150 205 100 15
kohms %
Excluding resistor accuracy. Note 1 R = 10 kohms. note 1 R = 100 kohms. note 1 Normal mode
ms ms ms
note 1: watchdog timing period calculation formula: Twd HS1 and HS2: High side output pin Rdson at Ta=25C, and Iout -150mA Rdson at Ta=125C, and Iout -150mA Rdson at Ta=125C, and Iout -120mA Output current limitation Over temperature Shutdown Leakage current Output Clamp Voltage at Iout = -100mA Ron25 Ron125 Ron3 Ilim Ovt Ileak Vcl
= 0.991 * R + 0.648 (R in kohms and Twd in ms).
2
2.5 4.5
Ohms Ohms Ohms
Vsup>9V Vsup>9V 5.53 300 155 430 600 190 10 -6
mA
C
note 1
uA V
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(Vs1 and Vs2 from 5.5V to 18V and Tamb from -40C to 125C unless otherwise noted)
Characteristics Description Symbol Min Typ Max Unit Conditions
note 1: when over temperature occurs, switch is turned off and latched off. Flag is set in SPI. HS3: High side output pin Rdson at Tj=25C, and Iout -50mA Rdson at Ta=125C, and Iout -50mA Rdson at Ta=125C, and Iout -30mA Output current limitation Over temperature Shutdown Leakage current Ron25 Ron125 Ron3 Ilim Ovt Ileak 60 155 100 7 10 14 200 190 10 Ohms Ohms Ohms mA
C
Vsup>9V Vsup>9V 5.5note 1
uA
note 1: when over temperature occurs, switch is turned off and latched off. Flag is set in SPI SENSE CURRENT AMPLIFIER SECTION:
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Rail to rail input voltage Output voltage range Output voltage range Input bias current Input offset current Input offset voltage Supply voltage rejection ratio Common mode rejection ratio Gain bandwidth Slew rate Phase margin
Open loop gain
Vimc
-0.1
0.1 0.3
Vcc+0.1
Vcc-0.1 Vcc-0.3 250
V
V V nA nA mV dB dB Guaranteed by design Guaranteed by design Guaranteed by design Output current +- 1mA Output current +-5 mA
Vout1 Vout2
Ib
Io Vio
SVR CMR
-100 -15 60 70 1 0.5 40 85
100 15
GBP SR PHMO OLG
Mhz
V/us dB
For gain=1,load 100pF// 5kohms. Guaranteed by design
Guaranteed by design
L1, L2 inputs Negative Switching Threshold Vthn 2 2.5 2.7 2.7 3 3.5 0.5 -10 8 20 2.5 3 3.2 3.3 4 4.2 3 3.5 3.7 3.8 4.5 4.7 1.3 10 38 V 5.5VPositive Switching Threshold
Vthp
V
Hysteresis Input current Wake up Filter Time STATE MACHINE TIMING Delay between CSB low to high transition (at end of SPI stop command) and Stop mode activation (Guaranteed by design) Interrupt low level duration Internal oscillator frequency accuracy Normal request mode time out Delay between SPI command and HS1, HS2 or HS3 turn on (note 1, 2) Delay between SPI command and HS1, HS2 or HS3 turn off (note 1, 2) Delay between Normal Request and Normal mode, after W/D trigger command Delay between CSB wake up (CSB low to high) and SBC normal request mode (Vdd1 on & reset high)
Vhyst Iin Twuf
V uA us
Tstop-m Tstop-nw Tstop-M Tint Osc-f1 NRtout Ts-HSon Ts-HSoff Ts-NR2N
1.4 6 12 7 -35 97 150 10
5 30 50 13 35 205 20 20
us us us us % ms us us us
Minimum Watchdog period No watchdog selected Maximum watchdog period
All modes, for info only Normal request mode Normal mode Vsup>9V, Vhs >= 0.2 Vs1 Normal mode Vsup>9V, Vhs <= 0.8 Vs1 Normal request mode, Guaranteed by design SBC in stop mode
6
35
30
Tw-csb
15
40
80
us
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(Vs1 and Vs2 from 5.5V to 18V and Tamb from -40C to 125C unless otherwise noted)
Characteristics Description Delay between CSB wake up (CSB low to high) and first accepted SPI command Delay between INT pulse and 1st SPI command accepted The minimum time between two rising edges on the CSB Symbol Min Tw-spi Ts-1stspi T2csb 90 30 15 Typ Max N/A N/A us us us SBC in stop mode In stop mode after wake up Unit Conditions
note 1: when IN input is set to high, delay starts at falling edge of clock cycle #8 of the SPI command and start of device activation/deactivation. 30mA load on HS switches. Excluding rise or fall time due to external load. note 2: when IN used to control HS switches, delays measured betxween IN and HS1 or HS2 on /off. 30mA load on HS switches. Excluding rise or fall time due to external load. Rx: LIN physical layer output Low Level Voltage Output Vol Voh 0 3.75 0.9 5.25 V V I in +1.5mA I out 250uA
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High Level Voltage Output Tx: LIN physical layer input Low Level Voltage Input High Level Voltage Input Input Threshold Hysteresis Pull-up Current Source
Vil Vih Vinhyst Is 3.5 50 -100 550
1.5
V V
800 -20
mV uA 1V LIN: physical layer bus (Voltage Expressed versus Vsup Voltage) Low Level Dominant Voltage High Level Voltage (Tx high, Iout = 1uA) Pull up Resistor to Vsup Vlin-low Vlin-high Rpu Vsup-1 20 30 47 1.4 V V
kohms
external bus pull 500 Ohms Recessive state In normal mode. In sleep and stop mode if not turned off by SPI In sleep and stop mode with 30k disconnected
Pull up current source Over current shutdown threshold Over current shutdown delay Leakage Current to GND Gnd disconnected, Vgnd = Vsup, VLin at -18V Leakage Current to GND, Vsup Disconnected, VLin at +18V Lin Receiver Vil (Tx high, Rx low) Lin Receiver Vih (Tx high, Rx high) LIN Receiver Threshold center LIN Receiver Input Hysteresis LIN wake up threshold
Ipu Iov-cur Iov-delay Ibus-pasrec Ibus no gnd Ibus Lin-vil Lin-vih Lin-thres LIN hyst LIN wu 0 0.6 VSUP 0.475 0 -1 50
1.3 75 10 3 20 1 1 10 0.4VSUP VSUP 0.5 0.525 0.175 0.5 150
uA
mA us uA mA uA Vsup disconnected Vlin at +18V Guaranteed by design Recessive state, Vsup 8V to 18V, Vlin 8V to 18V
Vsup Vsup Vsup
(Lin-vih - Lin-vil) / 2 Lin-vih - Lin-vil
LIN physical layer: bus driver timing characteristics for normal slew rate (note 1) Dominant propagation delay Tx to LIN Dominant propagation delay Tx to LIN Recessive propagation delay Tx to LIN Recessive propagation delay Tx to LIN Prop delay symmetry: tdom min - trec max tdom min tdom max trec min trec max dt1 -10.44 50 50 50 50 us us us us us Measurement threshold 58.1% Vsup Measurement threshold 28.4% Vsup Measurement threshold 42.2% Vsup Measurement threshold 74.4% Vsup
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Prop delay symmetry: tdom max - trec min dt2 11 us
note 1: Vsup from 7V to 18V, bus load R0 and C0 1nF/1k, 6.8nF/660, 10nF/500. Measurement thresholds: 50% of Tx signal to LIN signal threshold defined in the column "condition"
LIN physical layer: bus driver timing characteristics for slow slew rate (note 1) Dominant propagation delay Tx to LIN Dominant propagation delay Tx to LIN Recessive propagation delay Tx to LIN Recessive propagation delay Tx to LIN Prop delay symmetry: tdom min - trec max Prop delay symmetry: tdom max - trec min tdom min tdom max trec min trec max dt1s dt2s -22 100 100 100 100 23 us us us us us us Measurement threshold 61.6% Vsup Measurement threshold 25.1% Vsup Measurement threshold 38.9% Vsup Measurement threshold 77.8% Vsup
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note 1: Vsup from 7V to 18V, bus load R0 and C0 1nF/1k, 6.8nF/660, 10nF/500. Measurement thresholds: 50% of Tx signal to LIN signal threshold defined in the column "condition"
LIN physical layer: bus driver fast slew rate LIN high slew rate (programming mode) Dv/Dt fast 13 V/us Fast slew rate
LIN physical layer: receiver characteristics and wake up timings Receiver dominant propagation delay Receiver recessive propagation delay Receiver prop delay symmetry Bus wake up deglitcher Bus wake up event reported TrL TrH Tr-sym TpropWL Twake -2 30 70 20 3.5 3.5 6 6 2 90 us us us us us LIN low to Rx low. Note 2 LIN high to Rx high. note 2 TrL - TrH Sleep and stop mode Note 3
note 2: Measured between LIN signal threshold "Lin-vil" or "Lin-vih" and 50% of Rx signal. note 3: Twake is typically 2 internal clock cycles after LIN rising edge detected. Ref to "LIN bus wake up behavior" figure. In sleep mode the Vdd rise time is strongly dependant upon the decoupling capacitor at Vdd pin.
Figure 3. Test circuit for timing measurements
Vsup Vsup Tx LIN Rx Gnd C0 R0 R0 and C0: 1k/1nF, 660ohms/6.8nF and 500ohms/10nF
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Figure 4. timing measurements for normal slew rate
Tx recessive state
Vrec LIN Tdom min 58.1% Vsup 40% Vsup 28.4% Vsup Tdom max
Trec max 74.4% Vsup
60% Vsup 42.2% Vsup
Trec min
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Rx TrL TrH
Figure 5. timing measurements for slow slew rate
Tx recessive state
Vrec LIN Tdom min 61.6% Vsup 40% Vsup 25.1% Vsup Tdom max
Trec max 77.8% Vsup
60% Vsup 38.9% Vsup
Trec min
Rx TrL TrH
Figure 6. LIN bus wake up behavior
SBC in sleep mode recessive level Vsup LIN 0.4Vsup dominant level Vdd INT recessive level Vsup LIN 0.4Vsup dominant level SBC in stop mode
TpropWL
Twake
TpropWL
Twake
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3 STATE MACHINE
Vddlow (150ms) expired and VSUV = 0 Vdd high & Reset counter (1ms) expired & W/D not selected
Vdd high & Reset counter (1ms) expired & W/D selected
Reset
SBC power up Vdd low OR (NR time out occurs (150ms) & W/D selected)
Normal Request
W/D trigger
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Power Down
Vdd low OR (W/D fail & W/D selected)
Normal
Sleep command Stop command
Vdd low Wake up
Wake up
Stop Sleep
W/D selected means: external resistor between Wdc pin and gnd or Wdc pin open. W/D not selected means Wdc pin connected to gnd. W/D fail means: W/D trigger occurs in closed window or no SPI W/D trigger command. Stop command means: SPI stop command. Sleep command means: SPI sleep request followed by SPI sleep command. Wake up means: L1 or L2 state change or LIN bus wake up or CSB rising edge.
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4 PIN DESCRIPTION
pin name Vs1 Vs2 GND aGND T-GND Vdd Reset Wdc Tx Rx LIN HS1, HS2, HS3 L1, L2 Vcc EE+ Out MOSI MISO SCLK CSB INT IN Table 4-1. Pin number 13 10 12 16 8,9,24,25 15 22 21 32 31 11 7,6,5 2,4 17 19 20 18 27 28 26 29 30 23 function Power supply pin. Supply for the voltage regulator and the internal logic. Power supply pin. Supply for the high side switches. Electrical ground pin pins for the device. Analog ground pin for voltage regulator and sense amplifier. Thermal ground pins for the device 5V regulator output. Reset output Configuration pin for the watchdog. A resistor is connected to this pin.The resistor value defines the watchdog period. If the pin is open, the W/D period is fixed (default value). If this pin is tied to gnd the watchdog is disabled. Transmitter input of the LIN interface Receiver output of the LIN interface LIN bus line High side driver output 1, output 2 and output 3 Wake input 1, wake up input 2 5V supply input of operational amplifier Inverted input of the sense amplifier Non inverted input of the sense amplifier Output of the sense amplifier SPI: Master Out Slave In pin SPI: Master In Slave Out SPI: Clock input pin SPI: Device chip select pin Interrupt output pin AND wake up event signalling in stop mode. Direct input for PWM control of High Side switches 1 and 2
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5 GENERAL DESCRIPTION
The LIN SBC is an integrated circuit dedicated to automotive applications. It includes the following functions: - One full protected voltage regulator with 50mA total output current capability available at Vdd external pin, with under voltage reset function. - Programmable window watchdog function, INT output - Wake up from Lx wake input and LIN bus - LIN physical interface - Two 150mA high side protected switches PWM capable for relay or lamp drive - One 50mA high side protected switch for hall sensor or - Current sense op amp Device Supply The device is supplied from the battery line through the Vs1 and VS2 pins. An external diode is required to protect against negative transients and reverse battery. It can operate from 4.5V and under the jump start condition at 27V DC. Device functionality is guaranteed down to 4.5V at VS1 and VS2 pins. This pin sustains standard automotive voltage conditions such as load dump at 40V. Over and under voltage warning. If the voltage at VS1 exceed 20V typical or falls below 6V typical, the device generates an INT. VSOV or VSUV bits are set in the SPI register. Information is latched until the bit is read AND the fault has disappeared. The interrupt is not maskable. 5.3 5.4 LIN physical interface: The device contains an integrated LIN physical interface. 5.2 5.1
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L1 and L2 inputs: These pins are used to sense external switches and to wake up the device from sleep or stop mode. During normal mode the state of these pins can be read through SPI. HS1 and HS2: These are two high side switches to drive load such as relays or lamps. They are protected against over current and over temperature and include internal clamp circuitry for inductive load drive. Control is done through SPI. PWM capability is offered through the IN input. If PWM control is required, the internal circuitry which drive the internal high side switch is an AND function between the SPI bit HS1 (or HS2) and the IN input. In order to have HS1 on, bit HS1 must be set and IN input must be tied to a micro controller PWM ouptut to generate the PWM control signal (HS1 on when IN is high, HS1 off when IN is low). Same for HS2 output. If not PWM control is required, IN input must be connected to Vdd or to a high logic level, then the control of HS1 and HS2 is done through SPI only. If over temperature occurs on any of the 3 switches, the faulty switch is turned off and latched off until HS1 (or HS2 or HS3) bit is set to 1 in the SPI register. The failure is reported through SPI by HSst bit. 5.6 5.7 5.8 HS3: This high side switch can be used to drive small lamps, hall sensor or switch pull up resistors. Control is done through SPI Sense amplifier: E+, E- and OUT are the 3 terminations of the current sense amplifier. The amplifier is enable in normal mode only. Mode of operation Mode are controlled by the mode1 and mode 2 bits in the SPI register. 3 modes are available: sleep, stop and normal. 5.5
The operation modes and the associated functions are described in the table below. HS1 HS2 HS3 Operational amplifier Not active
Device Mode
Voltage Regulator
Wake up capabilities
Reset output
Watchdog function
LIN interface
Reset
Vdd: ON
N/A
Low for typ 1ms, then high (if Vdd above threshold) - High. - Active low if Vdd under voltage occurs and if Normal Request timeout (if W/D enable)
Disable
OFF
Recessive only
Normal Request
Vdd: ON
N/A
150ms time out if W/D enabled.
ON or OFF
Transmit and Receive
Not active
Table 5-1.
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Device Mode Voltage Regulator Wake up capabilities Watchdog function HS1 HS2 HS3 LIN interface Operational amplifier
Reset output
Normal
Vdd: ON
N/A
- High. - Active low if Vdd under voltage occurs or if W/D fail (if W/D enable) - Normally high. - Active low if Vdd under voltage occurs - Low - Go to high after wake up and Vdd within spec
Window WD if enabled.
ON or OFF
Transmit and Receive Recessive state with Wake capability Recessive state with Wake capability
Active
Stop
Vdd ON, limited current capability Vdd OFF, (Set to 5V after wake up to enter Normal request)
LIN and state change on Lx inputs LIN and state change on Lx inputs
Disable
OFF
Not active
Sleep
Disable
OFF
Not active
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Table 5-1.
Sleep and stop mode enter: To safely enter sleep or stop mode and to ensure that these modes are not entered by noise issue during SPI transmission, a dedicated sequence combining bit controlling the LIN bus and the device mode must be send twice. Enter sleep mode: first and second SPI commands (with bit D6=1, D7=1, D5 =0 or 1, D1=0 and D0=0) 11x0_0000 must be sent. Enter stop mode: first and second SPI commands (with bit D6=1, D7=1, D5 =0 or 1, D1=0 and D0=1) 11x0_0001 must be sent. Sleep or stop mode is entered after the second SPI command. D5 bit must be set accordingly. 5.9 Window watchdog. The window watchdog is configurable using external resistor at Wdc pin. The W/D is cleared through mode1 and mode 2 bit is SPI register. If Wdc pin is left open a fixed watchdog period is selected (typ 150ms). If no watchdog function is required or to disable the watchdog, the Wdc pin must be connected to gnd. The watchdog period is calculated by the following formula:
Twd = 0.991 * R +0.648 (with R in kohms and Twd in ms).
window closed no watchdog clear allowed
window open for watchdog clear
Twd * 50%
Twd * 50% Watchdog period Twd
Window watchdog operation Watchdog clear: The watchdog is cleared by SPI write command with following mode1 and mode2 bits. Mode 2 0 0 1 1 Mode 1 0 1 0 1 Mode Sleep mode (note 1) Stop mode Normal mode + W/D clear (note 2) Normal mode
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Note 1: Special SPI command and sequence is implemented in order to avoid to go into sleep or stop mode with a single 8 bit SPI command. Note 2: When a zero is written to "Mode1" bit while "Mode2" bit is written as a one, after the SPI command is completed "Mode1" bit is set to one and SBC stays in normal mode. In order to set the SBC in sleep mode, both "Mode1" and "Mode2" bits must be written in the same 8 bits SPI command. The W/D clear on normal request mode (150ms) has no window. 5.10 INT pin: This pin is used to report fault to the MCU. Int pulse is generated in case of: - Vdd regulator temperature pre warning - high side switch 1, 2 or 3 thermal shutdown - Vsup over voltage (20V typ) - Vsup under voltage (6V typ). If an INT is generated, when the next SPI read operation is performed bit D7 is set to 1. This mean that the bits (D6 to D0) report the interrupt source. In case of wake up from stop mode, INT is set low in order to signal to the MCU wake up event from L1, L2 or LIN bus.
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6
6.1
SPI INTERFACE AND REGISTER DESCRIPTION
Data format description Bit7 MISO D7 Bit6 D6 Bit5 D5 Bit4 D4 Bit3 D3 Bit2 D2 Bit1 D1 Bit0 D0 MOSI
The SPI is an 8 bits SPI. All bits are data bytes. The MSB is send first. The minimum time between two rising edges on the CSB pin is 15us. During an SPI communication the state of MISO reports the state of the SBC, at time of CSB high to low transitions. The status flag are latched at CSB high to low transitions. Following tables describe the SPI register bit meaning, "reset value" and "bit reset condition". D7 W R Write Reset value Write Reset condition LINSL2 INT source 0 POR, RESET D6 LINSL1 LINWU or LINFAIL 0 POR, RESET D5 LIN-PU VSOV D4 HS3 VSUV BATFAIL (note1) 0 POR, RESET D3 HS2 VddT D2 HS1 HSst D1 Mode2 L2 D0 Mode1 L1
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0 POR
0 POR, RESET
0 POR, RESET
-
-
Note 1: The first SPI read, after reset, returns the BATFAIL flag state on bit D4. D7 signals INT source. After INT occur, D7 read as a "1" means other bits report the INT source. D7 read as a "0" mean no INT occurred and other bit report real time status. 6.2 6.2.1 Write control bits: Mode control bits:
Mode 2 0 0 1 1 6.2.2 High side switches control bits: HS1 0 1 6.2.3 Description HS1 off HS1 on (if IN = 1)
Mode 1 0 1 0 1
Description Sleep mode Stop mode Normal mode + W/D clear Normal mode
HS2 0 1
Description HS2 off HS2 on (if IN = 1)
HS3 0 1
Description HS3 off HS3 on
LIN pull up termination control bits:
LIN-PU 0 1
Description 30k pull up connected in sleep and stop mode 30k pull up disconnected in sleep and stop mode
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6.2.4 LIN slew rate control and device low power mode pre selection:
LINSL2 0 0 1 1
LINSL1 0 1 0 1
Description Lin slew rate normal (baud rate up to 20kb/s) Lin slew rate slow (baud rate up to 10kb/s) Lin slew rate fast (for program download, baud rate up to 100kb/s) Low power mode (sleep or stop mode) request, no change in LIN slew rate
6.3 6.3.1
Read control bits: Switch input wake up and real time status: L2 0 1 Description L2 input low L2 input high or wake up by L2 (first register read after wake up) L1 0 1 Description L1 input low L1 input high or wake up by L1 (first register read after wake up)
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6.3.2
High side switch, voltage regulator and device supply status VSUV BATFAIL 0 1
HSst 0 1
Description HS no over temp HS1,2 or 3 OFF (over temp) LIN bus status LINWU LINFAIL 0 1
VddT 0 1
Description No over temperature Vdd over temperature pre warning
Description Vsup above 6V Vsup below 6V
VSOV 0 1
Description Vsup below 19V Vsup above 18V
6.3.3
Description No LIN bus wake up of failure LIN bus wake up occurred or LIN over current of over temperature
6.3.4
Interrupt status INT mask 0 1 Description SPI word read reflects the flag state SPI word read reflects the interrupt or wake up source
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